CMKD6263 TR PBFREE

CMKD6263 SURFACE MOUNT SILICON TRIPLE ISOLATED HIGH VOLTAGE SCHOTTKY DIODE w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMKD6263 contains three (3) galvanically isolated, high voltage Silicon Schottky diodes, epoxy molded in a SOT-363 surface mount package. This ULTRAmini™ device has been designed for fast switching applications requiring a low forward voltage drop. MARKING CODE: K63 SOT-363 CASE FEATURES: • Meets Galvanic Isolation Requirements of IEEE 1394 • High Voltage (70V) MAXIMUM RATINGS: (TA=25°C) Peak Repetitive Reverse Voltage Continuous Forward Current Peak Forward Surge Current, tp=1.0s Power Dissipation Operating and Storage Junction Temperature Thermal Resistance • Requires less board space than 3 individual diodes • Low Forward Voltage SYMBOL UNITS VRRM IF 70 V 15 mA IFSM PD 50 mA 250 mW -65 to +150 °C 500 °C/W TJ, Tstg ΘJA ELECTRICAL CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN TYP MAX IR VR=50V BVR IR=10μA VF IF=1.0mA CJ trr UNITS 10 200 nA 395 410 mV VR=0, f=1.0MHz 2.0 pF IR=IF=10mA, Irr=1.0mA, RL=100Ω 5.0 ns 70 V R5 (11-December 2015) CMKD6263 SURFACE MOUNT SILICON TRIPLE ISOLATED HIGH VOLTAGE SCHOTTKY DIODE SOT-363 CASE - MECHANICAL OUTLINE PIN CONFIGURATION LEAD CODE: 1) Anode D1 2) Anode D2 3) Anode D3 4) Cathode D3 5) Cathode D2 6) Cathode D1 MARKING CODE: K63 R5 (11-December 2015) w w w. c e n t r a l s e m i . c o m CMKD6263 SURFACE MOUNT SILICON TRIPLE ISOLATED HIGH VOLTAGE SCHOTTKY DIODE TYPICAL ELECTRICAL CHARACTERISTICS R5 (11-December 2015) w w w. c e n t r a l s e m i . c o m CMKD6263 SURFACE MOUNT SILICON TRIPLE ISOLATED HIGH VOLTAGE SCHOTTKY DIODE TYPICAL ELECTRICAL CHARACTERISTICS R5 (11-December 2015) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)